2nd week of Intership

12th April 2010
Weekends ended and its time to continue work for the second week of my internship. I arrived early around 7.45am and had breakfast at the cafe. Got back to my cubicle and around 8.30am came Mr. Azhar. He gave me details on how to use the AutoCAD software ANSYS software to do the finite element analysis for a semiconductor package. He used drawings to explain to me to make sure i am clear about what is he saying about. He told me its important to know the stress level in a semiconductor package because its for us to know weather it can be produced for customers or not.

It took me quite long to complete the partition of the AutoCAD drawing. Mr Azhar is a very patient engineer and good at explaining. I will always approach him on the things which i am not sure of. After completing the drawing i went for my lunch as it was already 12.30pm. I arrived back to my office around 1.20pm and waited for Mr Azhar to proceed to the next step of the drawings.

Mr Azhar came and told me to find the coordinates of the end points of the drawing and copy it into a text file. While i was doing that, the time passed quick and it was already 5.30pm when i finished copying the coordinates into the text file.

13th April 2010
I am ready to use the simulation software to run the thermal stress analysis simulation. the coordinates that i pasted in the text file was made the input file for my modelling in ANSYS. ANSYS is a software used to run simulation for stresses. ANSYS is a very interesting software. It is challenging when the drawing is done because the software doesnt allow any UNDO for error's. The modelling is done step by step. Materials and colours are assigned to the layer. The most important part is we need to assign the type of material and material properties. If we input the wrong property for the material, the results that we get wont be accurate. After inserting all the parameters than the model is ready to be mashed for easier analysis to be done. ANSYS can me done using commands or manually using the menubar. The whole day was used doing the modelling as i was still new to this software. Mr Azhar told me once I get hands on it, it will be very easy to be done. The software is let to run when I was about to go home.

14th April 2010.
Its a new day. The results for my simulation is done. All together is got 7 diferent results according to the different load steps. From this simulation, the maximum stress a semiconductor package can stand is 210MPa. This is according to the Mohr's circle theory. The results that i got from the simulation is lower than 210MPa. This tells me that the package can be manufactured.