3rd Week of internship

19th APRIL 2010
A beautiful Monday morning and i am ready for my third week of internship. Mr Azhar ask me to settle all my reports for the previous weeks tasks, and look for him once i am done. When i completed my reports, i looked for Mr Azhar and he gave me 4 new tasks to be done. Basically those tasks were to do some experiment on the previous package which I analyzed.

Task 1: Study the Lead Frame Thickness effect on principle stress S1
Task 2: Study the effect of Die Thickness on principle stress S1
Task 3: Study the effect of Die Attach Thickness on the principle stress S1
Task 4: Study the effect of Package Thickness on the principle stress S1

I begin to redo the drawings and also plot it into the ANSYS software. The stress analysis is onli done on the die unit as the other compnents such as lead frame, die attach and mold compund seldom have defects.

Even the task looks easy it takes a quite long time for the simulation to be done. The package modeling is done and the simulation is runned.

20th APRIL 2010
The simulation run for the initial size and is recorded and the data for the second simulation is created. First i choose to run the package thickness data. The package thickness dimensions is changed and the data is inserted into ANSYS. The simulation is first run for the 0.75mm package thickness and the results is obtained. After that i compared it with the 0.9mm package thickness. From this results, we get to compare how package thickness manipulation gives changes to the stress that is produced on the die.

21st APRIL 2010
The simulation for the die attach thickness is done according to the steps like previously done. The die thickness which was taken into comparisson are the 0.5mils/0.000013m and 1.0mils/0.0000254m. The results obtained was recorded and a graph is plotted for the analysis to be done.

22nd APRIL 2010
Today i was called to attend the company orientation program for new workers and trainees. Me and a few other trainess attended this program from 8.30am till 3.30pm. In this program, we were shown and briefed about the companies misson,vision, and other services provided by the company. After coming back from the orientation program, i continued with my simulation for the next set o data. This time it was time to analyze the effect of the lead frame thickness. The lead frame thickness which were analyzed is 8 Mils/0.000203m , 6 Mils/0.000152m , 4 Mils/0.000102m. The results were taken and saved.

23rd APRIL 2010
Its friday again and i am quite happy as it was the last day of work for the week. Today i came in to office and started to run my simulation for the last criteria which is the die thickness. 4 die thickness were to be tested and it would take a long time as one simulation will take around 2 hours. The die thickness that was tested is 10 Mils/0.000254m , 8 Mils/0.000203m , 6 Mils,0.000152m and 4 Mils/0.000102m. After running the simulation for all 4 die thickness, the data is taken down and it was time to start doin my report for the 4 different tests. Its 5.30pm and time to go back and have a weekend rest and continue my reports on Monday.