I got an offer to do my Internship programme at ON Semiconductor Seremba.
My first day at this company was 5th of April. I reached the guard house at around 7.45am and went to the Human Resource office after getting my temporary pass for the day. I reported to Mr T. Kumar who was the person incharge at the HR office. He asked me to go into a room and read up some rules and regulations need to be followed during working hours. After readin the rules and regulations me and another trainee also from UNITEN was asked to fill up a few forms regarding our personal details. After doing so we were given forms to fill in our details to make our company pass. After making the company pass we were given our lockers to put our belongings. Mr T. Kumar after that called our respective supervisors to pick us up from the HR office. It was 10AM by that time and i was given a 15 minutes break time. After break i went back to my cubicle and than came my supervisor Mr. Shutesh. Mr. Shutesh gave me a brief explanation what my work was all about. He also gave me some information about the company and about semiconductors. Mr. Shutesh is a very friendly and knowledgeable guy. Mr Shutesh gave me a few semiconductor books to read to make me understand more on semiconductor even i am not taking electrical and electronics engineering course. He said is important for me to know more than knowing less. He told me my task will be more on Finite Element Analysis (FEA). I went back to my cubicle and met Mr Azhar over there. He was incharged in giving me task to be done during my industrial training. I just read about the semiconductor and try to understand about the materials used in semicondcutors. It was a quite tiring day at work as it was my first day working from 8.00 AM to 5.30 PM.
On the second day 6th April, I reached my office about 7.50AM. During the second day there was nothing much as i continue to read my semiconductor notes and also was given a few software manuals that will be used during my industrial training tasks.
7th April 2010, the third day. Today Mr Shutesh told me that he will take me on a knowledge tour to the company production line. I was given the smock to use. It is a must to use the smock when we are in the production line. Before lunch time, i was brought to the Front End Process side. Here i got to see how the begining of a semiconductor Process. I was shown and given explanation about the die bond process, die curing process, plasma cleaning process, and also the wire bond process. It is lunch time and i went to have lunch with my work mates. After lunch i was anxiously waitin for my supervisor to bring me to the back end process site. As i was told earlier by Mr. Shutesh, i will be looking at molding compund, plating, final test and dicing process in the back end process area. In the molding process, i saw how the type of mold compund used and also the conventional and modern process for molding took place. Obviously the modern process is faster than the conventional process. Next i was brought to the plating process area. In this area i didnt get to see much on how the process was done as it was a fully covered process from the begining until the ending because it uses a lot of chemicals during this process. Normally the process of plating uses Tin as its material. Plating is done mainly because the lead frame component will get oxide if it is left outside. After the plating is done the package will be brought to the dicing section where the units will be diced into its individual shape and sent to the final test area. In the final test area, the units are feeded into a machine where the machine is programmed to test the unit according to its usage. After the final test process, the unit goes to a process called tape and reel which is the final process in the back end area,and finally the units are ready to be package and shipped to its customers. I was also given a glance through the failure analysis lab where those failed and rejected units are tested and defined for its defects.
8th April 2010.
Mr Shutesh exposed me with another important element is semiconductor assembly industry. He taught me how to do measurements on the units which are produced. This measurement is done and the data is collected according to elements measured. The measurements are done using a scope where it displays the enlarged version of the unit on the LCD screen and the readings are shown. A variety of reading is taken randomly choosing random units. 30 measurements were taken and recorded. After recording, the data is transfered to the Microsoft Excel worksheet and later calculation of min value, max value,average value,standard deviation, and also Cpk calculation is done. The new thing that i learned from this measurements is the Cpk calculation which means the units production capability. From this production capability, we can know how many parts per million defects that we have.
9th April 2010.
It's the last day of the week. Mr Shutesh called me to his office and asked me what i have learned and understand so far. He also asked me weather there is anything i am not sure of. He told me, that the process tour was for me to know what are the material used and the important part is I must know about the properties of materials that is used in the production line. It is important for me to know about the materials properties, as it is important later on when I am doing the Finite Element Analysia (FEA). All those material properties will be the main input for the solution for calculation. Lets call it a day in rest during the weekend.!!~~!!
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