Time passed so fast during the weekend and its time to start the fifth week of my training. I was given several task to be done through out the week. This week Mr. Azhar asked me to used different Lead Frame Materials, different Die attach material and Different Molding compound material to do the analysis for the first package. This task was given to me to show how the die unit reacts to the different type of material used in production.
Lead Frame Material
1) C194
2) Alloy42
3) TAMAC 4
Die Attach Material
1)Epoxy Ablestik Sumitomo 1084P
2)Epoxy Sumitomo CRM 1076WB
Molding Compound Material
1)Sumitomo EME-G760
2)Sumitomo EME-G600
3)Nitto MP-8000CH4ES
Wednesday, May 12, 2010
4th Week of Internship
2926th April 2010
Its the fourth week of my industrial training and i have learned many things and even looking forward to learn more in the time to come. Today, I was given a new package to analyze by myself without the help of Mr. Azhar. This task looks challenging. The drawing for this package looked more difficult. I begin to simplify the drawing in AutoCAD to prepare it for my analysis in ANSYS. After doing the simplification for the drawing the data was inserted into the ANSYS software and the simulation was started.
27th April 2010 - 28th April 2010
In both this days i did various analysis for this package same as the previous package to find out the suitable size and thickness
29th April 2010 - 30th April
Today i was given a more mechanical task. It has nothing to be done with semiconductor device. The problem was to analyze the corner angle bracket. The drawing was done manually is ANSYS using the menu commands. The process was one step by step and will be more detailed in the report with the drawings.
Tomorrow is 1st May and its LABOUR DAY. Finally i have the chance to celebrate Labour Day.
Its the fourth week of my industrial training and i have learned many things and even looking forward to learn more in the time to come. Today, I was given a new package to analyze by myself without the help of Mr. Azhar. This task looks challenging. The drawing for this package looked more difficult. I begin to simplify the drawing in AutoCAD to prepare it for my analysis in ANSYS. After doing the simplification for the drawing the data was inserted into the ANSYS software and the simulation was started.
27th April 2010 - 28th April 2010
In both this days i did various analysis for this package same as the previous package to find out the suitable size and thickness
29th April 2010 - 30th April
Today i was given a more mechanical task. It has nothing to be done with semiconductor device. The problem was to analyze the corner angle bracket. The drawing was done manually is ANSYS using the menu commands. The process was one step by step and will be more detailed in the report with the drawings.
Tomorrow is 1st May and its LABOUR DAY. Finally i have the chance to celebrate Labour Day.
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