Its the 8th week and another month left for my internship. Gained alot of knowledge for this past few weeks and waiting to absorb more knowledge.
In this week i have spent most of my time in the production line getting to know how the wire bond process is done. There were a few machine specialist who were willing to tell me about the wire bonding process. Looking at them doing thier daily task was bored until learning some hands on with the machine took place. Learned some important parts of the machine and learned how to insert wire into the machine. Each device which is produced uses different methods of wire bonding. In this week i also learned the different ways of handling gold and copper wires.
On the last day of this week, the wire bond engineer Siew Han showed me how to setup the machine and gave me some guideline on how the machine operates. She set each parameter for the device which need to be runned on the following week by me. She was going on vacation leave and asked me to help her in running the EBR's for the device. She has set every important parameter and assigned an enginner to assist if any error happens during the execution.
Tuesday, June 8, 2010
Wednesday, June 2, 2010
Internship Week 7
In the 7th week of my internship, i started doing something new and different rom the previous weeks. The previous week i was more to the designing and analysis section, and this week is time for me to learn something about process.
I have visited the production line in the first week of my internship in this company. At that time it was just a brief explanation about the company. In this week i was placed in the molding or encapsulating section for the semiconductor package. Everything looks easy in this molding process as its done by the machine automatically but the tough part is all the input parameters need to be given by the process engineer incharged in this molding section.
Every parameter which is inserted into the machine needs to be varified for the safety during the molding process. To ensure nothing happens to the unit during molding a dummy molding session is done and analyzed.
In the molding department, the process engineer incharge Mr. Seah showed me how the complete molding process and inspection takes place. Mr Seah taught me how to clean the mold press chamber. A few steps were done to do the clean up.
The mold chamber cleaning process consists of a few steps. The mold press chamber is cleaned once in every 24 hours. This cleaning process is done to ensure there is no dirt in the molding chamber as the mold compound tends to stick at the chamber after a long time.
After showing me the details of the cleaning process Mr. Seah showed me how the molding is done and how the inspection is done.
The inspection is done on Xray to see weather there are any wire strips, mold void or incomplete fill during the molding process. The 3 problems above might cause the unit to be failed and rejected.
I have visited the production line in the first week of my internship in this company. At that time it was just a brief explanation about the company. In this week i was placed in the molding or encapsulating section for the semiconductor package. Everything looks easy in this molding process as its done by the machine automatically but the tough part is all the input parameters need to be given by the process engineer incharged in this molding section.
Every parameter which is inserted into the machine needs to be varified for the safety during the molding process. To ensure nothing happens to the unit during molding a dummy molding session is done and analyzed.
In the molding department, the process engineer incharge Mr. Seah showed me how the complete molding process and inspection takes place. Mr Seah taught me how to clean the mold press chamber. A few steps were done to do the clean up.
The mold chamber cleaning process consists of a few steps. The mold press chamber is cleaned once in every 24 hours. This cleaning process is done to ensure there is no dirt in the molding chamber as the mold compound tends to stick at the chamber after a long time.
After showing me the details of the cleaning process Mr. Seah showed me how the molding is done and how the inspection is done.
The inspection is done on Xray to see weather there are any wire strips, mold void or incomplete fill during the molding process. The 3 problems above might cause the unit to be failed and rejected.
WEEK 6 Internship
It has been 1 and a half months of internship. Everything looks fine at the moment and gaining more and more knowledge in the coming days.
For this week i was given a task to do the thermal analysis for the previous package which is QFN2545. The pure thermal analysis took me quite a time as i didnt know what was the commands all about. Thermal analysis is much more tougher than thermal stress analysis. Searching in the help menu of the software on what is the commands all about took me some time.
Unlike stress analysis which needs a lot of material properties, pure thermal analysis only needs the thermal conductivity of the materials,k.
The model for this package was taken from the previous assignment and only the analysis is different.
First of all we need to find the film coefficent for the unit. The commands for the calculation is done by the software. All need to be done is inserting certain numbers and formulas. After inserting the film coefficient, we need to input the heat flux for the material at its places and finally the boundry condition is input. The boundry condition is the package is set to an ambient temprature of 25 degree celcius.
After inputing all the properties and parameters, the solution for the package is done and the results is taken. The first simulation was a failure as the value that was displayed is more than what was needed. After finding out the problem and doing some changes in the commands the results is obtained again.
The process looks simple but it took me quite a time as it was a new thing for me to learn about.
For this week i was given a task to do the thermal analysis for the previous package which is QFN2545. The pure thermal analysis took me quite a time as i didnt know what was the commands all about. Thermal analysis is much more tougher than thermal stress analysis. Searching in the help menu of the software on what is the commands all about took me some time.
Unlike stress analysis which needs a lot of material properties, pure thermal analysis only needs the thermal conductivity of the materials,k.
The model for this package was taken from the previous assignment and only the analysis is different.
First of all we need to find the film coefficent for the unit. The commands for the calculation is done by the software. All need to be done is inserting certain numbers and formulas. After inserting the film coefficient, we need to input the heat flux for the material at its places and finally the boundry condition is input. The boundry condition is the package is set to an ambient temprature of 25 degree celcius.
After inputing all the properties and parameters, the solution for the package is done and the results is taken. The first simulation was a failure as the value that was displayed is more than what was needed. After finding out the problem and doing some changes in the commands the results is obtained again.
The process looks simple but it took me quite a time as it was a new thing for me to learn about.
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