In the 7th week of my internship, i started doing something new and different rom the previous weeks. The previous week i was more to the designing and analysis section, and this week is time for me to learn something about process.
I have visited the production line in the first week of my internship in this company. At that time it was just a brief explanation about the company. In this week i was placed in the molding or encapsulating section for the semiconductor package. Everything looks easy in this molding process as its done by the machine automatically but the tough part is all the input parameters need to be given by the process engineer incharged in this molding section.
Every parameter which is inserted into the machine needs to be varified for the safety during the molding process. To ensure nothing happens to the unit during molding a dummy molding session is done and analyzed.
In the molding department, the process engineer incharge Mr. Seah showed me how the complete molding process and inspection takes place. Mr Seah taught me how to clean the mold press chamber. A few steps were done to do the clean up.
The mold chamber cleaning process consists of a few steps. The mold press chamber is cleaned once in every 24 hours. This cleaning process is done to ensure there is no dirt in the molding chamber as the mold compound tends to stick at the chamber after a long time.
After showing me the details of the cleaning process Mr. Seah showed me how the molding is done and how the inspection is done.
The inspection is done on Xray to see weather there are any wire strips, mold void or incomplete fill during the molding process. The 3 problems above might cause the unit to be failed and rejected.
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