WEEK 6 Internship

It has been 1 and a half months of internship. Everything looks fine at the moment and gaining more and more knowledge in the coming days.

For this week i was given a task to do the thermal analysis for the previous package which is QFN2545. The pure thermal analysis took me quite a time as i didnt know what was the commands all about. Thermal analysis is much more tougher than thermal stress analysis. Searching in the help menu of the software on what is the commands all about took me some time.

Unlike stress analysis which needs a lot of material properties, pure thermal analysis only needs the thermal conductivity of the materials,k.

The model for this package was taken from the previous assignment and only the analysis is different.

First of all we need to find the film coefficent for the unit. The commands for the calculation is done by the software. All need to be done is inserting certain numbers and formulas. After inserting the film coefficient, we need to input the heat flux for the material at its places and finally the boundry condition is input. The boundry condition is the package is set to an ambient temprature of 25 degree celcius.

After inputing all the properties and parameters, the solution for the package is done and the results is taken. The first simulation was a failure as the value that was displayed is more than what was needed. After finding out the problem and doing some changes in the commands the results is obtained again.

The process looks simple but it took me quite a time as it was a new thing for me to learn about.